A New Fan-Out-Package-Embedded Power Inductor Technology

In this letter, a fan-out-package-embedded power inductor technology is proposed. The inductor is embedded in a silicon-based fan-out package and surrounds the packaged die in which a voltage converter IC can be put. To demonstrate the integrated power inductor technology, a 2.4-nH air-core inductor for integrated voltage regulator applications is fabricated. The fabricated inductor shows a dc resistance of 5.0 mΩ and quality factors of 43-67 in the frequency range of 100-500 MHz. The small dc resistance and high quality factors make this integrated inductor technology promising for integrated power conversion.