I. Introduction
Optical communication has had a significant impact to overcome the everlasting high-speed data transmission requirements by enabling high bandwidth and therefore high data transfer rates across the world. For long-haul applications, optical solutions have vanquished the cost barrier and are now used around the world, e.g., from transatlantic communications cables to fiber-to-the-home. However, optical communication has a huge potential for microelectronic applications as well, i.e., at inter- and intra-chip level [1]. Conventional methods to increase the performance of semiconductor devices are approaching their physical limits. Hence, the 3D chip integration is rising as an industry accepted alternative to cope with the expected year-on-year performance growth [2]. With increasing transistor count, the BEOL challenges are also increasing (density, performance limitation, thermal budget, bandwidth, etc.) [3], [4]. The global internet data transfer rate is reaching 0.5 Pbit/s [5].