A Thermal-Aware Physical Space Reallocation for Open-Channel SSD With 3-D Flash Memory

3-D flash memory faces a number of challenges, including thermal issues and process variation. The high temperature will cause charge loss and lead to the fluctuation of threshold voltage. To address the thermal issue of 3-D flash memory, this paper presents ThermAlloc, a novel thermal-aware physical space allocation strategy for open-channel solid-state drive with 3-D charge trapping flash memory. ThermAlloc permutes the allocation of physical blocks. Consecutively accessed logical blocks are distributed to different physical locations in order to prevent the accumulation of hotspots. The objective is to postpone garbage collection operations and keep the distribution of block temperature well under control. We demonstrate the viability of the proposed technique using a set of extensive experiments. Experimental results show that ThermAlloc can reduce the peak temperature by 26.94% with 3.15% extra worst-case response time in comparison with the baseline scheme.