I. Introduction
Due to the limitations of silicon (Si) material properties, Si-based power electronics semiconductor devices have been gradually unable to meet today's high performance requirements for semiconductor devices in power electronics [1]. Based on this, gallium nitride (GaN) as the representative of the wide band gap semiconductor material came into being, compared to Si devices, GaN has higher bandwidth, breakdown voltage, and thermal conductivity, and these excellent features make GaN have significant advantage in high frequency and high power density applications [2]– [4]. As the most promising switching devices, there are already EPC, Transphorm, GaN systems, and other manufacturers to produce GaN high electron mobility transistor (HEMT). In order to predict the characteristics of GaN HEMT and optimize the power electronics circuits design with GaN HEMTs, an accurate GaN HEMT model is necessary [5], [6].