I. Introduction
With the growth in applications of the millimeter-wave spectrum for terrestrial wireless communication, satellite radio, automotive radar, electronic warfare, and instrumentation systems, the demand for fully integrated broadband high-power, high-efficiency power amplifiers (PAs) is growing [1]–[4]. To meet this demand, the III–V compound semiconductor monolithic microwave integrated circuit (MMIC) is the preferred choice for such PAs [5]. In order to obtain the high-power level for the abovementioned systems, it is a common method to combine the output power () of several individual MMIC PA chips [6]. However, this combination can cause an increased loss in the synthetic network. Thus, to compensate for this loss, it is generally necessary to add a driver amplifier chip appropriately. As a result, the increased number of amplifier chips in the system leads to a higher production cost. Meanwhile, in order to improve the interstage stability, it is necessary to add isolators to guarantee the multistage amplifier cascade work properly [7], [8], which also can make the system more complex and expensive. In conclusion, to simplify the system structure and to reduce the cost, the high-gain and high-power MMIC PA is extremely desired [9]–[11].