Electrically Small, Cooling-Enhanced, Ungrounded Shielding Gasket for Compact and Wideband Integrated Circuits

This article proposes an ungrounded shielding gasket that can be applied in the packages of integrated circuits (ICs). Benefitting from the slow-wave and SNG properties, the gasket with an electrically small transverse length, i.e., 3 mm, can change and mitigate the resonances of the original package, and thus a wideband shielding from 5 to 18 GHz, can be achieved. Meanwhile, the proposed gasket is validated to benefit the heat dissipation capability of the original package, which thus shows advantages in both shielding bandwidth and cooling performance. The proposed gasket is experimentally validated, where a good agreement between simulation and measurement is achieved. Such a shielding technique can serve as a good candidate in the shielding packages of compact and wideband ICs.