I. Introduction
Performance advantages and economic considerations are driving modern transceiver designs toward the single-package integration of multiple radiofrequency integrated circuits (RFICs). This tightening integration necessitates a renewed focus on microwave shielding structures built into the package itself. Unfortunately, electromagnetic compatibility (EMC) research to-date has not yet demonstrated techniques for the direct evaluation of vector electromagnetic leakage within highly integrated electronic modules [1]–[6].