Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules

With the development trend of high power, high integration, and miniaturization of power electronics, the junction temperature has increased up to 250°C. Moreover, an integrated power module is composed of multiple chips, and its thermal field distribution is more complex than that of a single chip. Therefore, effective thermal analysis and reliability assessment of multi-chip power modules is very important. To solve this problem, our laboratory originally developed a thermal characteristics evaluation system for multi-chip SiC power modules. In this study, the new test platform was proposed. Based on finite element simulation, the thermal interference characteristics between chips were explored.