Development of the Integrated Passive Device for Sub6 Band Using 100 μm Thickness Glass Substrate

To further increase the integration of RF modules, it is necessary to reduce the size and height of an IPD (Integrated Passive Device) and a module substrate on which IPD are mounted. Therefore, using conventional FC-BGA manufacturing technology, an IPD which is used 100 μm thickness glass substrate for Sub6 band applications is developed. This IPD can be lower height than existing ceramic IPDs. Also using electromagnetic field simulation and machine learning techniques, the variation in cutoff frequency was estimated considering manufacturing variation. This method can be used for manufacturing system of module with embedding IPDs which is required high-precision filters.