Thermal Management Method of Three-dimensional Integrated Inductors Based on Dielectric-cavity TSV Technology

This paper proposes a 3D passive inductor model based on dielectric-cavity TSV technology and investigates its thermal management. Compared to a TSV-based 3D inductor in silicon substrate, it has a 20% higher Q-factor, but also experiences a 700% increase in peak temperature. Finite element simulation and analysis indicates that the upper insulation layer mainly hinders heat conduction. Thus, a thermal TSV is added for heat dissipation. Through finite element analysis, theoptimized dielectric-cavity-TSV inductorexhibited a temperature peak value approximately 20% lower than the original model.