An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging

With the development of electronic packaging technology, the packaging density of electronic components is increasing, and thermal issues have gradually been a main reason for electronic component failure. This paper proposes a transient isogeometric boundary element method (IGABEM) to solve the transient thermal problem in electronic packaging. The proposed method combines the advantages of isogeometric analysis (IGA) and boundary element method (BEM). Compared with finite element method, only the boundary element is needed in the computation, which reduces the preprocessing time since meshing process inside the computational domain being avoided. The radial integration method (RIM) is used to transform the domain integrals into equivalent boundary integrals. This work uses time marching method to handle equation that involves the time term. Finally, a transient heat transfer problem of a simplified chip-copper pillar bump structure is used to illustrate the accuracy of the proposed method.