Design of Spacer in Silicon Carbide Double-Sided Cooling Packaging Based on Multiphysics Finite Element Topology Optimization

This article proposes the topology optimization method on metal spacer in double-sided cooling (DSC) packaging silicon carbide (SiC) power module. As a typical structure of DSC packaging, spacer plays a critical role in determining the electric and thermo-mechanical performance of DSC packaging module. The topology optimization on spacer may reduce thermo-mechanical stress and improve reliability of packaging structure. The research comprehensively explores the performance of DSC structure with spacer, including the analysis of thermo-mechanical stress based on theory and simulation, dielectric performance and topology optimization model. Compared with traditional cuboid spacer, the optimized spacer achieves a 20.9% reduction of maximum von-Mises stress in attachment. It is also superior than some other spacers optimized through experience and simple mechanical principles.