The Effect of Epoxy Molding Compound Dispensing Uniformity on PoP Warpage

The package on package (PoP) assembly technology plays a significant role in the semiconductor packaging industry. Because of its strict requirements on thickness, the research of warpage is also paid much attention to it. In this paper, the impact of the assembly process on package warpage is the key idea. Three groups of experiment designs are to analyze the epoxy molding compound (EMC) dusting uniformity in the molding process whether affects the warpage value of the package. By analyzing the box plot of area visual inspection (AVI) warpage data at room temperature and the filler content of the package cross section, it is concluded that the filler content will be effected due to different EMC dispensing uniformity and thus have an impact on package warpage.