Thermal analysis of TSV with design factors

TSV is a technology that connects electrodes by drilling vias in the interposer. TSV technology offers advantages in terms of miniaturization, fast signal transmission, large capacity, and low power consumption. However, as chips become highly integrated, heat dissipation problems are getting severe. In this paper, the heating value of TSV interposer was analyzed by diameter, pitch, and aspect ratio. Icepak of Ansys 2022 R2 was used as an analysis tool, and the model was designed in the form of a 2.5D package including a logic chip and a memory chip. As a result the simulation, among the three design factors, diameter, aspect ratio, and pitch have the greatest influence in the order