Study on the effect of solder flux on the reliability of ceramic Package

This article focuses on the failure phenomenon of large-scale data processing microsystems after screening tests, and uses finite element simulation software combined with failure samples to study their failure mechanism. The microsystem package adopts a dual cavity structure with front and back sides, with parallel seam welding sealing on the front and gold tin sealing on the back. Different simulation models were established for the dispersion of failed gold tin solder samples, and qualitative comparative simulation analysis was conducted using finite element simulation software. Research has found that the main reason for the failure of the sample is the abnormal flow of the gold tin solder during the gold tin sealing process to the metallized inclusion area of the sealing ring, resulting in solder accumulation and local stress concentration. In subsequent screening tests, the superposition of environmental stress and residual stress resulted in ceramic cracking and device leakage failure. The research results of this article clarify that the issue of solder flow during the gold tin sealing process can have an impact on the reliability of the device, and this situation should be avoided, which has a certain guiding role for subsequent reliability evaluation and sealing process.