Thermal and Reliability Study of Self propagating Reaction Interconnects in Microsystem Integration

Microsystem heat dissipation is a hot topic in the field of electronic package, at the present, traditional thermal conductive adhesives are widely used for interconnection between chips and heat sinks in electronic package, while it has large thermal resistance and do not meet the reliability under long-term temperature change conditions. In this paper, a microsystem model of chip and heat sink connected by thermal conductive adhesive and SAC305/AlNi/SAC305 self-propagating reactive interconnection joint was established. The finite element simulation analysis method was used to calculate the thermal resistance of the chip under the two interconnect joints, and the fatigue life of the SAC305/AlNi/SAC305 self-propagating reactive interconnection joint at -55℃-85℃ was also calculated. The simulation results shown that the thermal resistance of the chip is reduced by 77.5% and the fatigue life of SAC305/AlNi/SAC305 self-propagating reactive interconnection joint can reach 1785 cycles, which meets the requirements of military and aerospace conditions for high reliability.