Thermal Stress Field of Al2O3/Al-Ni Nanofoil/Ni Solder Joints by Self-propagation Reactions

The connection between Al2O3 ceramics and metal has always been a difficult problem. In this study, the self-propagating combustion reaction of Al-Ni nanofoils was used as the heat source to interconnect Al
2
O
3
ceramics and metal Ni. Based on Comsol multi-physical field simulation software, the distribution and variation history of temperature and stress in solder joints during self-propagating combustion reaction were simulated and analyzed, including the change of transient temperature and thermal stress with reaction time, and the melting time of filler metal. The influence of solder layer thickness and Al-Ni nanofoils thickness on temperature and stress field of solder joints were investigated.