A Single-layer Photosensitive Polymer Material for Temporary Bonding and Laser Debonding

In this work, a photosensitive polymer material GT3 that can be used for laser debonded has been successfully developed. The material GT3 has the properties of not only a laser release layer but also an adhesive layer, thereby realizing a temporary bonding system constructed of a single-layer of polymer materials. The results show that the photosensitive polymer materials GT3 has significant ultraviolet absorption, with its transmission rate below 3% at 355 nm. It also exhibits excellent thermal stability, with temperatures greater than 270 ℃ at a 5% mass loss in a nitrogen atmosphere. By adjusting the modulus of the GT3 material, the laser energy density required during laser debonding can be regulated accordingly. Under laser ablation with a wavelength of 355 nm and an energy density below 100 mJ/cm
²
, room temperature, rapid, low stress separation of wafer bonded pairs of ultra-thin devices can be achieved. This work provides a simple, low-energy-density laser debonding solution for single-layer temporarily bonded materials.