Double-side Liquid Cooling Development for 6-in-1 SiC Power Module

For SiC power module, thermal management has become more significant to release device real potential and to maintain system reliability. A double-side liquid cooling solution has been developed for the lead frame based 6-in-l SiC power module for automotive applications. Liquid cooling plate based on jet array impingement has been designed and investigated. There are 6 main stagnation zones for heat dissipation of each SiC chip in the module. To consider system implementation and improve fluid motion inside cooling plate chamber, structure and layout modifications have been performed. Considering pumping power, the effect of pump pressure is studied. The designed cooling plate is attached to both top and bottom side of the power module. High heat transfer rate and uniform cooling for each chip has been achieved. The chip heat flux 600W/cm
²
can be dissipated, while keeping ~90°C maximum chip temperature rise and 2.3°C peak temperature difference of chips at different locations. With 50kPa pump pressure, more than 1kW total heat power of the module can be dissipated, while maintaining maximum chip temperature rise less than 100°C. The developed double-side cooling solution has been used to our designed 6-in-1 SiC power module.