Reliability Assessment of Gripper Socket Under Post-Silicon Validation Conditions

The reliability of sockets under post-silicon validation conditions is an important factor to consider when designing and selecting interconnects for validation platforms. Sockets enable the swap of a large number of electronic packages (Memory, SoC, etc..) with the same platform for the purpose of finding any Integrated Components (IC) design issues, quantifying part-to-part variability, and ensuring that the component is meeting its design intent. Socket stability over usage is a key metric in assuring that the collected data is not changing over time due to sockets. In this paper, we study the mechanical reliability of a 0.50mm pitch gripper-type socket. Factors such as the number of insertions/extractions effect on socket performance, the long-term stability of the socket over time, the solder joint deformation effect, and socket impact on Signal Integrity were studied. An eMMC (embedded Multimedia Card) was used in this study. eMMC was tested with both socketed soldered-down memory packages. Results showed that the socket was stable up to fifty insertions under room temperature- and up to two weeks of continuous testing. A single package can be socketed at least five times without a significant impact on its performance. No significant Signal Integrity degradation was detected, even though soldered eMMC parts outperformed the soldered counterparts, the platform was still able to run at the targeted speed with no issues.