Characterization of FOWLP Antenna in Packages

The Antenna in Package (AiP) based on Fan-Out Wafer-Level-Packaging (FOWLP) enables compact beam steering solutions for Satcom On the Move (SOTM) and 5G applications. This paper presents the characterization of such AiPs in terms of S parameters, Gain and patterns as well as its building circuits of microstrip line and power dividers at the 27-31GHz SOTM band. The 6mm×6mm×0.384mm AiP element shows a measured Return Loss (RL) of >11.5dB, Isolation >19.8dB, Gain of 5.1-6.8dBi over 27-31GHz as well as pure V and H dual polarizations; The 12mm×12mm×0.384mm AiP 2×2 array achieves pure V polarizations with a measured RL of >9dB and Gain of 8.1-10.8dBi over 27-31GHz.