Alignment Vision System for Hybrid Bonding

Hybrid bonding is important as a semiconductor stacking technology with fine pitch I/O. Further high precision is required for the bonding apparatus due to miniaturization of the size and pitch of the pad. In this report, we have developed an alignment scope for high-precision hybrid bonding equipment that achieves recognition accuracy of 3σ ≤ 5 nm. First, the specification examination of the optical system is explained, and then the evaluation result of recognition accuracy by the prototype optical system is presented. The results of the evaluation were satisfactory, and the long-term evaluation confirmed that it was sufficiently resistant to vibration prospected within the bonding equipment.