High-speed Optical Detection of Chipping Defects in a Die Bonder

During mechanical wafer dicing, chipping can occur, and this potentially leads to catastrophic failure in the application. Sorting-out these defective dice increases reliability. An all-optical detection approach with 5.5 μm resolution, a conventional algorithm, and an artificial intelligence-based (AI) detection routine are discussed. Step-cut mechanical diced wafers are assessed at high throughput in a die attach machine at high detection accuracy combined with an overkill rate smaller 0.2% for 30pm big defects.