Dielectric Characteristics of Polymer and Ceramic Based 3d Printing Materials for Various Manufacturing Defects

Additive manufacturing (AM), the industrial production name for 3D printing, has drawn the attention of researchers in power engineering, e.g., manufacturing circuit board substrates, graded insulator, cooling electric motor winding (heat exchanger), etc., for their simplicity in manufacturing, high insulation property of 3d printed materials, and achievable complex geometry. However, the inevitable manufacturing defects, such as surface roughness and air-filled cavities in the 3d printed object, are prone to increase dielectric challenges in medium to high voltage application. For this reason, the goal of this paper is to study electric field distribution of polycarbonate (PC) and ceramic
$(\mathrm{A}1_{2}\mathrm{O}_{3})$
, those are popularly used as 3d printing materials, for various manufacturing defects. Finite element analysis (FEA) of polycarbonate and
$\mathrm{A}1_{2}\mathrm{O}_{3}$
are conducted due to the presence of surface roughness and air-filled micro cavities using Ansys Electronics. Under high voltage, the electric field distribution is determined in the cavities and rough surface for each of these models.