Contents I. Introduction
In recent years, the rapid advancement of high-performance computing (HPC) integrated circuits (ICs) has imposed increasingly stringent demands on heat dissipation. Liquid metal has emerged as a promising solution for enhancing heat dissipation efficiency [1]–[3]. The electromagnetic pump (EMP) stands out among various methods due to its compact size and simplicity. The flow rate of liquid metal is directly proportional to the current passing through the EMP, necessitating the utilization of a DC-DC converter to supply a higher current for driving the pump [4]–[6].
