Improved non-destructive mutual inductance estimation method for multi-chip power modules

In multi-chip power modules, the extraction of mutual inductance is an enduring challenge. Recently, it has been demonstrated with an empirical, non-invasive, and non-destructive method the ability to measure the mutual inductance between the positive and negative terminals. This method relies on measuring the mutual inductance of a power module in the same fashion as a transformer. A problem of this method is the low Signal-to-Noise Ratio (SNR) due to the weak coupling between the module terminals. In this contribution, we will increase the effectiveness of this method by improving the hardware setup. The results will also be cross-validated with FEA model predictions for a module geometry.