A W-Band Wideband Via-Holes Transition Design Based on Multilayer LCP Substrate

In this letter, a design of W-band via-holes transition is proposed, this transition is implemented by multilayer liquid crystal polymer(LCP) technology. In order to improve the transmission performance of the via-holes transition, a defected ground structure(DGS) is introduced to reduce the parasitic effect between the blind via and the ground plane, and the field distribution of the transition loaded DGS is analyzed in detail. The simulated and measured return losses are both lower than - 10dB over the W-band, insertion losses are both above -3dB over 75-110GHz.