A Low-Cost, E-Band Surface Mounted Packaged Power Amplifier MMIC

To meet the commercial application requirements of high-speed wireless communication for millimeter wave MMICs, a E-Band surface mounted packaged power amplifier MMIC based on high-frequency laminate material using PCB process has been designed and fabricated. The design reduces processing costs and increases practical adaptability. The measurements demonstrates the packaged PA MMIC of a power gain of 14.5 dB, and saturated output power of 25 dBm.