Development and Characterization of Wideband Power Divider for Sub-THz Transceiver Modules

In this work, the development and characterization of a wideband power divider for Sub-THz applications have been presented. The divider is aimed to be used for dividing the IF signal at 50 GHz with a bandwidth of 40 GHz. The design is implemented on a low transmission loss 8-layers PCB whose modeling methodology will be highlighted. The design conceptually is based on shifting down the isolation plane below 90 degree length while utilizing a radial stub for compensating the change in the isolation element. The preliminary analysis for the design had been studied for a single stage model while the optimized design is measured back-to-back configuration and showed a good agreement to the simulation. The proposed design is implemented in a 275 GHz receiver module of multiple CMOS mixer chips fed from phased array antenna for enabling beamforming capability.