Investigation of impedance compensation for inductive via holes using capacitors

Via holes are widely used in printed circuit boards (PCBs) to connect the traces distributed in different layers. Sometimes, via holes are inductive and lead to impedance discontinuity in connection area, which may reduce signal integrity of circuit board. In the current work, a novel impedance compensation strategy for the inductive via holes was presented. Compared with the traditional compensation strategy using grounding via holes, compensation strategy using capacitors has a better electrical performance in low frequency band.