Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology

In the semiconductor packaging production line, with the increasing integration of chips, the size and pitch of solder joints are decreasing, which puts high demands on the alignment process. Especially with the emergence of chiplet and die-to-wafer technology, high-precision and high-speed alignment technology has become popular. In this paper, based on some image processing schemes, we propose a machine vision algorithm for realizing high-precision and high-speed flip chip bonding, and a flip chip bonding system is then constructed. Finally, the idea for the realization of the die-to-wafer bonding system is discussed.