Simulation of a BUCK Converter Using Behavioral Electrothermal Models of IGBT and PIN Diode

The representation of power semiconductors as an open or closed switch is sufficient for the modeling of converters for the purpose of their control. However, this representation is insufficient if we are interested in the switching of switches within the converters or in the thermal modeling of semiconductors. This paper presents a simulation of a BUCK converter using behavioral electrothermal models of IGBT(insulated-gate bipolar transistor) and PIN diode. The results demonstrate that the behavioral electrothermal model can precisely predict the switching behavior of the BUCK converter, and that it can be used to design and optimize the converter for improved performance and reliability.