Copper Nanowired Interconnection for Embedding Power Dies in PCB

This study presents a cost-effective copper interconnect solution for power die, using copper nanowires grown through a porous membrane. The nanowired bond demonstrates significantly lower electrical resistance compared to soldering and silver sintering methods. Nanowires from a self-organized membrane exhibit superior electrical performances due to their wider width and higher copper content on the interconnect. This proposed approach offers a promising alternative for high-power density applications with PCB integration, providing competitive electrical performance, reliability, and cost-effectiveness compared to traditional methods.