Abstract:
Recently, due to the increased performance and multi-functionality of electronic devices, there has been a significant surge in the demand for high-speed digital signal t...Show MoreMetadata
Abstract:
Recently, due to the increased performance and multi-functionality of electronic devices, there has been a significant surge in the demand for high-speed digital signal transmission. As a result, high-speed serial interfaces like USB (universal serial bus) and HDMI (high-definition multimedia interface) have rapidly replaced traditional parallel interfaces, facilitating high-definition video and high-capacity data transmission [1]. In order to facilitate the transmission of these high-speed signals, various standards employ miniaturized connectors and high-resolution bonding structures [2], [3]. Simultaneously, advanced semiconductor packages such as SiP (system-in-package) and 3-dimensional integrated circuits (3D-IC) have been introduced to overcome the limitations of semiconductor fabrication processes and enable increased system functionality through enhanced integration. To achieve this high-density integration, fine interconnect technologies such as copper pillar bumps, microbumps, and through silicon vias (TSVs) have been implemented, replacing conventional wirebond or C4 solder bumps [4]–[6]. These micro-interconnects have been widely adopted across different categories of systems and devices to achieve high speed and high integration, leading to the emergence of micro-bonding technologies.
Published in: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Date of Conference: 25-27 October 2023
Date Added to IEEE Xplore: 22 December 2023
ISBN Information: