Micro-Defect Failure Analysis in Fan-Out Package and Correspond to Finite Element Method (FEM) Simulation Results

The Fan-Out (FO) structures are used for the heterogeneous integration packages recently because it offer high I/O counts, high-integration capability, thinner package and the lower cost. As the complexity of multiple chips packages increased continuously, the failure analysis (FA) workflow are constantly facing the new challenges. In this paper, we investigate the FO package with the open failed after the temperature cycle test (TCT). The FA workflow is examined by the electrical testing, the 3 Dimensions X-Ray Microscope (3D X-Ray) and the Focus Ion Beam (FIB) to find out the failure location and the defect mode. Finally, we use finite element method (FEM) to investigate the global and the local stress distribution.