Integration of Failure and Predictive Analytics for Root Cause(s) of Early Lifetime Cracks in Ceramic Based Probe Card

Integration of traditional failure analysis with predictive analytics methodology is deployed to expedite determination of potential root cause(s) and their interactions leading to early life time cracks of a semiconductor wafer probe card. Root causes of early failure (i.e. activation of probe card, tip length and overdrive of pogo pins) were validated by experiments. This problem solving approach can be effectively used for early failure analysis of semiconductor devices leading to fast, accurate and efficient diagnosis of root causes of failures specially when failures are caused by multiple and non-linear interactions among different variables.