Ultra-precision cutting technology to fabricate the micro hole array having ultra-thin wall

Recent advanced industries such as display, semiconductor, micro sensors require the ultra-fine structures to increase the performance of device. The mechanical cutting is well-known simple process for manufacturing mold with fine structures. However, it is important to optimize cutting conditions while the machining load and tool friction deteriorate the machining results. In this research, ultra-precision end-milling is used to fabricate ultra-fine hole array with thin wall with width of 10 μm. The machining process is optimized by step-by-step machining to extract the cutting chip which can increase the cutting load, and it is confirmed by comparing machining load with one-pass machining to bottom of hole.