High Density Optical Transceiver Packaging Using Glass Substrates and Through Glass Vias

Through glass vias (TGV) are an emerging technology that enables electrical interposers with advantages over organic substrates. These advantages include excellent dimensional stability, a coefficient of thermal expansion (CTE) more closely matched with silicon dies, high thermal stability and high electrical isolation. These are all beneficial to the increased data rates that are required in modern systems. In addition, TGV can be beneficial for optical transceiver packaging design that supports higher data rates as well as higher densities. We describe the benefits of TGV technology in the design of an optical engine capable of supporting 112 Gbps channels with industry-leading density.