High Density Automotive Module with Fan-Out Package

In accordance with widespread of connected cars and autonomous driving, automotive SoCs (System-on-Chips) are required to have high-performance computing and high-speed transmission. As a result, requirements for package level heterogeneous integration have been increasing. However, 2.5D packaging structure is complicated and challenging to control manufacturability. This paper demonstrates a redistribution layer design, module substrate design, low power double data rate 4 (LPDDR4) electrical verification and reliability testing of a high-density multi-chip module with fan-out package.