Study on the Effect of Pulse Parameters on Nano-Copper Electric Pulse Sintering

Electric pulse sintering is a new sintering technology with the advantages of fast, efficient, and energy-saving, and its sintering effect is directly affected by its own pulse parameters. Under the electric pulse sintering evolution mechanism of Nano-copper bonding layer, this paper studies the influence of three pulse parameters, pulse width and amplitude, pulse energy, on the sintering quality by means of time-varying resistance, shear strength and static resistance, and micro morphology of the bonding layer, and finally explains the mechanism of pulse parameters affecting the sintering quality.