Analysis of Innovative 3D-Printed Direct Coolers for Modular Power Devices

This work focuses on innovative coolers for power semiconductor modules. The jet-impingement technique is used for direct device cooling with custom 3D-printed cooler structures. The paper presents a solution for power modules with dissipated power density up to 20 W/cm
²
. The coolers were designed using the Finite Element Method (FEM), which allows to evaluate both the thermal and hydraulic performance, and to identifying the optimal geometry. Experimental results of a 3D printed prototype are also presented, showing god agreement with the FEM simulations.