Thermal Test Vehicle for HPC – System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution

In this work, a Thermal Test Vehicle (TTV) is developed to demonstrate the thermal characterization utilities for large die area packages. The TTV consists of a silicon Thermal Test Chip (TTC) on organic interposer assembled with lid and thermally conductive adhesive as thermal interface material. The setup mimics the system-level application and the use of the transient thermal characterization method studying the local thermal impedance as thermal heat path signature Rth(x,y) for achieving spatial resolution with high granularity in the location of heat dissipation.To obtain a more comprehensive understanding of the thermal behavior, the structure function is determined and helps to characterize the spatially resolved heat transport through the layers of the large die area package architecture. Furthermore, the thermal influence of possible defects such as warpage, delamination or voids within the structure is investigated and how the power density distribution on chip level affects the thermal behavior.