Interconnects in a Multi-Layer Polymer-on-Si 50-GHz Packaging Technology

Heterogeneous integration allows the use of multiple RF technologies within the same packaging process. Interconnects are required to transition between different embedded structures and between different layers in multi-layer packaging processes. The State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program is developing a packaging method with six metalized organic dielectric layers on a central silicon interposer. Using this process, various interconnect structures are designed for dc to 50GHz operation. These interconnects transition between different types of transmission lines fabricated on different organic dielectric layers. Simulations and measurements of three different interconnect structures are presented. A return loss above 12dB is achieved across all the structures with a maximum insertion loss of 0.5dB, measured from 2 to 50GHz.