Full Wave IBM Plasma Substrate Benchmark By Cadence Clarity

The IBM Plasma substrate was first released in 2006 by IBM EIP group through IEEE EPEPS as a public challenge to advanced computational electromagnetic algorithms toward the full package simulation. It has been listed in the IEEE EPS EDMS Packaging Benchmark Suite to advance the state-of-the-art. In this paper, we report the up-to-date modeling performance using this package. After many years of its first release, we might be the 2^nd next to Ohio State University to report the full wave whole substrate simulation result. Today, the whole benchmark could be finished from setup to post data processing using Cadence® Clarity Cloud within a very short time. The results from our first run match the measured data very well. The contribution of this paper is to answer the call from IEEE EPS and update the performance of modern computational electromagnetics solutions for electronic packages.

I. Background Introduction

IEEE EPS EDMS Packaging Benchmark Sub-Committee created a publicly available suite of packaging benchmarks [1]. It becomes a powerful tool to promote research and applications of advanced modeling technologies for electronic packages, signal and power integrity, and multi-physics EDA solutions.