The multi-Layered Super Low Loss SAW Device with High Heat Dissipation and ultra-Low Profile Using Sapphire Substrate

The Multi-layered SAW greatly improves insertion loss and power handling. For the use of higher power applications or greater integration modules, improvement of heat dissipation and lower profile are required. In this work, we propose a novel package structure combining a multi-layered SAW that realizes the SAW devices with super low loss, high heat dissipation, and ultra-low profile.