The Thin Film Evaporation of R32/ R600 Mixture: A Molecular Dynamic Simulation

The utilization of mixed refrigerants in thermodynamic cycles is expected to improve the efficiency of the system. In the present paper, the evaporation behavior of the equimolar mixture of R32 and R600 on the copper surface is investigated by molecular dynamics approaches. The results denote that the evaporation process of the mixed R32/R600 liquid film can be roughly divided into the slow evaporation stage, stable evaporation stage and equilibrium stage. The evaporation rate of both R32 and R600 is maintained at a constant value during the stable evaporation phase, with the value of R32 being higher than that of R600. Besides, the evaporation of R32 and R600 is not synchronous. R600 enters both the stable evaporation phase and the equilibrium phase later than R32, indicating that the heat transfer thermal resistance of R600 is higher than that of R32. Furthermore, the three-dimensional vapor-liquid interface structure is obtained during the evaporation of the mixed R32/R600 liquid film. It is noticed that the undulation of the interface structure is greatest during the stable evaporation phase, where the vapor-liquid interface area is greater.