Innovative Packaging Integration Strategy for BiCMOS ICs Operating beyond 200 GHz

In this paper, an innovative packaging integration strategy compatible with Silicon-based technologies is proposed. It is assessed beyond 200 GHz by the integration of a BiCMOS WR3 back-to-back waveguide (WG) to suspended stripline (SSL) transition in organic laminate substrate. An insertion loss below 3 dB is obtained in the 220-320 GHz band, competing with traditional solutions using III-V substrates. Achieved performances are promising and could enable sub-THz volume-manufacturing packaging solutions for Silicon technologies.