Combined footprint of solder paste - influence of bismuth content on solder strength

The article describes the mixing of two solder pastes in a combined footprint - standard SAC305 and low temperature 58Bi42Sn. The combined footprint was carried out with a jet printer. The experiments were performed with a different ratio between standard and low temperature pastes. It was measured whether changing the amount of bismuth in the solder paste changed the breaking strength of the solders. A large number of electronic components are examined and analyzed to obtain an objective statistical analysis.