Optimizing High Bandwidth Memory in Multi-Die Systems

High bandwidth memory has gained widespread adoption in modern computer systems due to its ability to offer high performance and low power consumption. As the demand for faster and more efficient systems continues, HBM is increasingly being used in multi-die systems. However, the use of multiple dies in a system brings new challenges to optimize HBM memory performance. One key challenge in ensuring that the HBM memory is used efficiently across all dies as it can introduce bottlenecks in the system, such as more power consumption, less utilization of data channels, and higher latencies. Optimizing HBM memory in multi-die systems requires careful consideration of memory allocation and access patterns, scheduling of transactions, power consumption, and other system-level factors to achieve high performance and low power consumption. This paper covers a SystemC-based Transaction Level Modeling (TLM) solution that can be used to optimize HBM memory by providing suggestions for the areas of improvement in performance in the form of graphs and charts. The solution will allow the designers to incorporate their scheduling algorithm and try different configurations. It will help to optimize the memory subsystem in multi-die designs in the shortest possible time with maximum bandwidth and minimal latency. This is particularly important for high-performance computing applications, where efficient memory utilization is a key factor in achieving optimal performance.