Study of Coplanar Waveguide Wire Bonding Interconnection on MMIC

The packaging of monolithic microwave integrated circuit is one of its most important tasks before application. The model and equivalent circuit of gold wire is established. Full wave simulation is used to determine the effect on return loss with different wire parameters between coplanar waveguide. The optimized parameters are used in bonding process and an actual circuit’s return loss is measured by a vector network analyzer. Compare the measurement result with the simulation result, there is a same trend from 1GHz to 18GHz, and the return loss is lower than -17dB from 1GHz to 10GHz.